COMe-bEP7 New

COM Express® Basic Type 7 with AMD EPYC™ Embedded 3000 SoC Processors
Specifications
  • Supports Single-Die SP4r2 (up to 8 cores) and Dual-Die SP4 (up to 16 core) processors
  • Quad 10GbE interfaces
  • 4 x SODIMM sockets (up to 128GB DDR4 memory) on request
  • Industrial grade versions
Download Datasheet

The COM Express® module COMe-bEP7 based on AMD EPYC™ 3000 series processors extends Kontron’s product family of server-grade COM platforms. The COMe-bEP7 is headless and a cost efficient option for applications requiring high processing power such as Medical Imaging and Servers.

The COMe-bEP7 is a high performance module with scalable performance up to 16 cores. The module supports an optional four SODIMM sockets with up to 128GB memory as well as four 10Gb Ethernet ports. The COMe-bEP7 is offered for either commercial or extended temperature ranges.
 

Features

Compliance COM Express® Basic, Pin-out Type 7 - COM.0 R3.0
Dimension (H x W) 95 x 125 mm
CPU Commercial Temperature:
AMD E3101 4C/4T, 35W TDP, 2.1GHz (2.9GHz)
AMD E3151 4C/8T, 45W TDP, 2.7GHz (2.9GHz)
AMD E3201 8C/8T, 30W TDP, 1.5GHz (3.1GHz)
AMD E3251 8C/16T, 55W TDP, 2.5GHz (3.1GHz)
AMD E3351 12C/24T, 65-80W TDP, 1.9GHz (3.0GHz)
AMD E3451 16C/32T, 85-100W TDP, 2.45GHz (3.0GHz)

Industrial Temperature:
AMD E3255 8C/16T, 30-55W TDP, 2.0/2.5GHz (3.1GHz)
Main Memory SP4r2 (single-die):
2x DDR4 SODIMM for up to 64GB non-ECC/ECC memory

SP4 (dual-die):
2x DDR4 SODIMM for up to 64GB non-ECC/ECC memory
4x DDR4 SODIMM for up to 128GB on request
Ethernet Controller Internet i210
Ethernet 4x 10GbE KR/SFI
Hard Disk 2x SATA
PCI Express / PCI support SP4r2 (single-die):
24x PCIe Gen 3.0

SP4 (dual-die):
32s PCIe
USB 4x USB 3.1, 4x USB 2.0
Serial 2x serial interface
Common Features SPI Flash, LPC, SMB, Dual Staged Watchdog, RTC
On request for SP4 (dual-die): NVMe Support
Power Management OS ACPI PM support for Critical Shutdown
Power Supply ATX, 8.5V- 20 V Wide Range Single Supply
Special Features TPM
Humidity 93% relative Humidity at 40°C, non-condensing
Temperature Commercial Grade Version: 0°C to 60°C
Industrial Grade Version: -40°C to 85°C
BIOS AMI UEFI
Operating System Linux x64 – Ubuntu
Windows Server x64 2016
Supported Modules COMe-bEP7 xxxxx commercial grade
COMe-bEP7 E2 xxxxx industrial grade

Downloads

Solution Brief

Intel Solution Brief: Computer-on-Module Flexibility at the Edge
Kontron COM Express® and COM-HPC® modules with 13th Gen Intel® Core™ mobile processors deliver powerful performance, AI, and graphics with portfolio flexibility for industrial-grade deployments.
[ 18933-1-intel-rpl-p-kontron-solution-brief-v4.pdf, 1.67 MB, Mar.03.2023 ]

Use Cases

COM Express®: A RECIPE FOR IIOT SUCCESS
How Ectron is tapping into AI and machine learning to further modernize industrial baking, yielding greater efficiency for consistently delicious baked goods
[ ectron-case-study-resized.pdf, 3.93 MB, Apr.20.2023 ]

技术参数

Datasheet COMe-bEP7
[ come-bep7_datasheet.pdf, 2.41 MB, Sep.06.2023 ]

参考手册

COMe-bEP7 User Manual
[ come-bep7_user_manual_5-19-2022.pdf, 3.39 MB, Apr.20.2023 ]

General Safety Instruction
[ general-safety-instructions.pdf, 560.72 KB, Jan.04.2021 ]

应用案例

Autonomous Driving
Read how our COM Express® Module is working perfect for application from b-plus with its flexibility, bandwith, reliability and the required graphics.
[ uc_b-plus_eu.pdf, 4.78 MB, May.26.2021 ]

The tough choice of Processors
Solving challenges in selecting computer boards & modules for IIoT projects. In this article we support you to make the right choice for your application: To find the best balance of processing power, graphics capabilities and connectivity on the one hand and size, power consumption, and cost on the other.
[ artikel_processor-choice_eu-1-.pdf, 4.42 MB, Apr.20.2023 ]

COM Express® Basic for Autonomous Transportation in Rugged Environments
Implementing Kontron’s latest COMe® Basic based on Intel’s® 11th generation Xeon® processors and ECC memory provided the optimum power and performance
[ adas_en_use-case_kontron.pdf, 1.54 MB, Oct.11.2022 ]

Tech Spec Sheet

Tech Specs COM EXPRESS®
[ tech-spec_comexpress.pdf, 7.08 MB, Apr.04.2024 ]

Services

Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]

Variants

COMe-bEP7 E3101
68010-0000-01-1
COMe-bEP7 E3101  
COMe-bEP7 E3151
68010-0000-51-1
COMe-bEP7 E3151  
COMe-bEP7 E3201
68010-0000-01-2
COMe-bEP7 E3201  
COMe-bEP7 E3251
68010-0000-51-2
COMe-bEP7 E3251  
COMe-bEP7 E3351
68010-0000-51-3
COMe-bEP7 E3351  
COMe-bEP7 E3451
68010-0000-51-4
COMe-bEP7 E3451  
COMe-bEP7 E3451 with 4 SODIMM sockets
68010-0000-61-4
COMe-bEP7 E3451 with 4 SODIMM sockets  

Accessories

COMe Mount Kit 5mm 1set
38017-0000-00-5
COM Express® Mounting Kit 5mm 1set for threaded HSP and Cooling Solutions  
COMe Mount Kit 5mm 100sets
38017-0100-00-5
COM Express® Mounting Kit 5mm 100 sets  
COMe Mount KIT 8mm 1set
38017-0000-00-0
COM Express® Mounting Kit 8mm 1set for threaded HSP and Cooling Solutions  
COMe Mount Kit 8mm 100sets
38017-0100-00-0
COM Express® Mounting Kit 8mm 100sets  
ADA-COMe-Height-dua
38019-0000-00-0
ADA-COMe-Height-dua  
KAB-HSP 200mm
96079-0000-00-0
Fan cable adapter for 3pin standard FAN connector to 3pin molex connector, cable length 200mm  
COMe Eval Carrier T7 Gen2
COMe Eval Carrier T7 Gen2 COM Express® Eval Carrier Type 7 more
COMe Eval Carrier T7
68300-0000-00-0
COMe Eval Carrier T7 COM Express® Eval Carrier Type 7 more
HSP COMe-bEP7 THREADED
68010-0000-99-0
Heatspreader for COMe-bEP7, threaded mounting holes  
HSP COMe-bEP7 THROUGH
68010-0000-99-1
Heatspreader for COMe-bEP7, through mounting holes  
DDR4-2666 8 GB non-ECC
97020-0827-BEP7
Memory: DDR4-2666, 8 GByte, non-ECC
Operating Temperature: 0°C- 60 °C
 
DDR4-2666 16 GB non-ECC
97020-1627-BEP7
Memory: DDR4-2666, 16 GByte, non-ECC
Operating Temperature: 0°C- 60 °C
 
DDR4-2666 32 GB non-ECC
97020-3227-BEP7
Memory: DDR4-2666, 32 GByte, non-ECC
Operating Temperature: 0°C- 60 °C
 
DDR4-2666 16 GB non-ECC
97021-1627-BEP7
Memory: DDR4-2666, 16 GByte, non-ECC
Operating Temperature: -40 °C - 85 °C
 
DDR4-2666 8 GB non-ECC
97021-0827-BEP7
Memory: DDR4-2666, 8 GByte, non-ECC
Operating Temperature: -40 °C - 85 °C
 
DDR4-2666 32 GB non-ECC
97021-3227-BEP7
Memory: DDR4-2666, 32 GByte, non-ECC
Operating Temperature: -40 °C - 85 °C
 
DDR4-2666 8 GB ECC
97030-0827-BEP7
Memory: DDR4-2666, 8 GByte, ECC
Operating Temperature: 0°C- 60 °C
 
DDR4-2666 16 GB ECC
97030-1627-BEP7
Memory: DDR4-2666, 16 GByte, ECC
Operating Temperature: 0°C- 60 °C
 
DDR4-2666 32 GB ECC
97030-3227-BEP7
Memory: DDR4-2666, 32 GByte, ECC
Operating Temperature: 0°C- 60 °C
 
DDR4-2666 8 GB ECC
97031-0827-BEP7
Memory: DDR4-2666, 8 GByte, ECC
Operating Temperature: -40 °C - 85 °C
 
DDR4-2666 16 GB ECC
97031-1627-BEP7
Memory: DDR4-2666, 16 GByte, ECC
Operating Temperature: -40 °C - 85 °C
 
DDR4-2666 32 GB ECC
97031-3227-BEP7
Memory: DDR4-2666, 32 GByte, ECC
Operating Temperature: -40 °C - 85 °C
 


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